Patent Assignment
Reel/Frame 053818/0321
Assignment of Assignor's Interest
Recorded: 2020-09-18
Pages: 5
Assignors
LIU, CHUNLEI
Executed: 2020-09-03
MOHN, FABIAN
Executed: 2020-07-15
SCHUDERER, JÜRGEN
Executed: 2020-09-03
Assignees
AUDI AG
INGOLSTADT, 85045, GERMANY
ABB SCHWEIZ AG
BROWN BOVERI STRASSE 6, BADEN, 5400, SWITZERLAND
Covered Property
(1)
Method for Producing a Semiconductor Module by Using Adhesive Attachment Prior to Sintering
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 14, 2022
From: ABB SCHWEIZ AG
To: ABB POWER GRIDS SWITZERLAND AG
Reel/Frame 059252/0887 →
Change of Name
Mar 15, 2022
From: ABB POWER GRIDS SWITZERLAND AG
To: HITACHI ENERGY SWITZERLAND AG
Reel/Frame 059268/0085 →
Change of Name
Jun 24, 2024
From: HITACHI ENERGY SWITZERLAND AG
To: HITACHI ENERGY LTD
Reel/Frame 067815/0091 →