Patent Assignment
Reel/Frame 059252/0887
Assignment of Assignor's Interest
Recorded: 2022-03-14
Pages: 6
Assignor
ABB SCHWEIZ AG
Executed: 2020-11-18
Assignee
ABB POWER GRIDS SWITZERLAND AG
BRUGGERSTRASSE 72, AARGAU, BADEN, 5400, SWITZERLAND
Covered Property
(1)
Method for Producing a Semiconductor Module by Using Adhesive Attachment Prior to Sintering
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 18, 2020
From: LIU, CHUNLEI; MOHN, FABIAN; SCHUDERER, JÜRGEN
To: AUDI AG; ABB SCHWEIZ AG
Reel/Frame 053818/0321 →
Change of Name
Mar 15, 2022
From: ABB POWER GRIDS SWITZERLAND AG
To: HITACHI ENERGY SWITZERLAND AG
Reel/Frame 059268/0085 →
Change of Name
Jun 24, 2024
From: HITACHI ENERGY SWITZERLAND AG
To: HITACHI ENERGY LTD
Reel/Frame 067815/0091 →