IP Library › Assignment 053971/0554
Patent Assignment
Reel/Frame 053971/0554

Assignment of Assignor's Interest

Recorded: 2020-10-05 Pages: 4
Assignors
MATSUMURA, TOSHIAKI
Executed: 2020-09-23
NAGASE, NAO
Executed: 2020-09-25
SAITO, YOSHIHIKO
Executed: 2020-09-30
SUGAWARA, NOBUTOSHI
Executed: 2020-09-23
TANAMACHI, TAKAHIRO
Executed: 2020-09-28
Assignee
SANDISK TECHNOLOGIES LLC,
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property (1)
Semiconductor Die Including Edge Ring Structures and Methods for Making the Same
Application: 17/062,765 →
Publication: US 2021/0313246
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →