IP Library › Assignment 054492/0882
Patent Assignment
Reel/Frame 054492/0882

Assignment of Assignor's Interest

Recorded: 2020-11-30 Pages: 6
Assignors
LIU, YONG
Executed: 2020-11-19
ST. GERMAIN, STEPHEN
Executed: 2020-11-12
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Reducing Stress Cracks in Substrates
Application: 17/247,094 →
Publication: US 2022/0173049
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 17, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 055315/0350 →
Release of Security Interest in Patents Previously Recorded at Reel 055315, Frame 0350 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0881 →