Patent Assignment
Reel/Frame 054562/0432
Assignment of Assignor's Interest
Recorded: 2020-12-07
Pages: 3
Assignors
HOSODA, NAOHIRO
Executed: 2020-12-07
TSUTSUMI, MASANORI
Executed: 2020-12-07
NAGAMINE, SAYAKO
Executed: 2020-12-07
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Memory Die with Source Side of Three-Dimensional Memory Array Bonded to Logic Die and Methods of Making the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Assignment of Assignor's Interest
Mar 27, 2025
From: COUSSIROU, JEAN CHARLES MARIE; VANARET, THOMAS EMILE
To: SAFRAN AIRCRAFT ENGINES
Reel/Frame 070645/0498 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →