Patent Assignment
Reel/Frame 070645/0498
Assignment of Assignor's Interest
Recorded: 2025-03-27
Pages: 3
Assignors
COUSSIROU, JEAN CHARLES MARIE
Executed: 2023-10-16
VANARET, THOMAS EMILE
Executed: 2023-10-16
Assignee
SAFRAN AIRCRAFT ENGINES
2 BOULEVARD DU GÉNÉRAL MARTIAL VALIN, PARIS, 75015, FRANCE
Covered Property
(1)
Memory Die with Source Side of Three-Dimensional Memory Array Bonded to Logic Die and Methods of Making the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 7, 2020
From: HOSODA, NAOHIRO; TSUTSUMI, MASANORI; NAGAMINE, SAYAKO
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 054562/0432 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →