Patent Assignment
Reel/Frame 054602/0561
Assignment of Assignor's Interest
Recorded: 2020-12-10
Pages: 2
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Element, Resin Composition for Forming Barrier Layer, Method for Forming Resist Pattern, and Method for Manufacturing Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.