IP Library Assignment 054752/0374
Patent Assignment
Reel/Frame 054752/0374

Assignment of Assignor's Interest

Recorded: 2020-12-28 Pages: 5
Assignors
NOMA, TAKASHI
Executed: 2019-01-24
SEDDON, MICHAEL J.
Executed: 2019-01-22
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Backside Metal Photolithographic Patterning Die Singulation Systems and Related Methods
Application: 17/134,717 →
Publication: US 2021/0118675
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 17, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 055315/0350 →
Release of Security Interest in Patents Previously Recorded at Reel 055315, Frame 0350 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0881 →