Patent Assignment
Reel/Frame 055276/0703
Assignment of Assignor's Interest
Recorded: 2021-02-16
Pages: 6
Assignors
SHI, XINHONG
Executed: 2021-02-05
FU, HAITAO
Executed: 2021-02-05
ZHANG, JUN
Executed: 2021-02-05
ZHOU, HUAMEI
Executed: 2021-02-05
ZHU, LONGXIU
Executed: 2021-02-05
IMMONEN, MARIKA
Executed: 2021-02-05
Assignee
TTM TECHNOLOGIES INC.
200 EAST SANDPOINTE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
High-Density Optical Waveguide Structure and Printed Circuit Board and Preparation Method Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Corrective Assignment to Correct the Asssinee's Name Previously Recorded at Reel: Frame: . Assignor(S) Hereby Confirms the Assignment.
Aug 17, 2023
From: SHI, XINHONG; FU, HAITAO; ZHANG, JUN; ZHOU, HUAMEI
To: TTM TECHNOLOGIES, INC.
Reel/Frame 064622/0725 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →