Patent Assignment
Reel/Frame 064622/0725
Corrective Assignment to Correct the Asssinee's Name Previously Recorded at Reel: Frame: . Assignor(S) Hereby Confirms the Assignment.
Recorded: 2023-08-17
Pages: 13
Assignors
SHI, XINHONG
Executed: 2021-02-05
FU, HAITAO
Executed: 2021-02-05
ZHANG, JUN
Executed: 2021-02-05
ZHOU, HUAMEI
Executed: 2021-02-05
ZHU, LONGXIU
Executed: 2021-02-05
IMMONEN, MARIKA
Executed: 2021-02-05
Assignee
TTM TECHNOLOGIES, INC.
200 EAST STANDPOINTE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
High-Density Optical Waveguide Structure and Printed Circuit Board and Preparation Method Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 16, 2021
From: SHI, XINHONG; FU, HAITAO; ZHANG, JUN; ZHOU, HUAMEI
To: TTM TECHNOLOGIES INC.
Reel/Frame 055276/0703 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →