IP Library Assignment 055427/0001
Patent Assignment
Reel/Frame 055427/0001

Assignment of Assignor's Interest

Recorded: 2021-02-24 Pages: 383
Assignor
THE DOW CHEMICAL COMPANY
Executed: 2018-11-01
Assignee
DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
400 ARCOLA ROAD, COLLEGEVILLE, PENNSYLVANIA, 19426
Covered Property (1)
High Temperature Epoxy Adhesive Formulations
Application: 16/613,501 →
Publication: US 2021/0155835
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 24, 2021
From: LUTZ, ANDREAS; SCHNEIDER, DANIEL; HAAG, BENJAMIN ALEXANDER; MAEDER, IRENE
To: DOW EUROPE GMBH
Reel/Frame 055391/0183 →
Assignment of Assignor's Interest Feb 24, 2021
From: DOW EUROPE GMBH
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 055391/0318 →
Assignment of Assignor's Interest Feb 24, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 055400/0386 →
Change of Name Mar 30, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 055763/0358 →