IP Library Granted Patent US 11,739,241
Granted Patent B2
US 11,739,241 · App. 16/613,501 · Granted Aug 29, 2023

High temperature epoxy adhesive formulations

Inventors: Andreas Lutz (Freienbach, CH); Daniel Schneider (Freienbach, CH); Benjamin Alexander Haag (Horgen, CH); Irene Maeder (Freienbach, CH); Marcel Aschwanden (Freienbach, CH)
Assignee: DDP SPECIALTY ELECTRONIC MATERIAL US, LLC
C09J163/04C08G18/12C08G18/3215C08G18/4854C08G18/69C08G18/73C08G59/245C08G59/4021C08L9/02C08L63/04C08L75/08C08L79/02C08G2170/00C08L2205/025C08L2205/035C09J2203/354C09J2301/30
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Quick Facts
Patent No.
US 11,739,241
App. No.
16/613,501
Granted
Aug 29, 2023
Kind
B2
Abstract

The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.

Claims (18)

1. An adhesive epoxy resin system comprising:

a. 30-70% by weight of one or more diglycidyl ether bisphenol A resins, comprising a mixture of 40% by weight solid resin and 60% by weight liquid resin based on the weight of the mixture of solid and liquid resins,

b. 1-10% by weight of an epoxy novolac resin wherein the epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol,

c. 10-30% by weight of a polyurethane toughener,

d. 5-20% by weight of a flexibilizer, wherein the flexibilizer is a carboxy terminated acrylonitrile butadiene epoxy adduct or a polyamine epoxy adduct,

e. 1-8% by weight of a hardener, and

f. at least 0.1% by weight of an aromatic urea based cure accelerator,

wherein the weight percents are based on total weight of the system;

wherein the polyurethane toughener is the reaction product of 10-95% by weight polytetramethylene ether glycol with 2-55% by weight of a polybutadiene-diol, 2-40% by weight of a diisocyanate and 0.1-50% by weight of cashew nut shell oil, all based on the weight of the toughener, and

wherein the toughener is chain extended by reaction with a polyphenol chain extender, wherein said chain extender is o,o′-diallylbisphenol A; and

wherein the adhesive epoxy resin system is a two-component system wherein a first component comprises the one or more diglycidyl ether bisphenol A resins and the epoxy novolac resin and a second component comprises the polyurethane toughener, the hardener and the cure accelerator.

2. The adhesive epoxy resin system of claim 1 further comprising a filler in an amount of 5 to 30% by weight.

3. The adhesive epoxy resin system of claim 1 wherein the epoxy novolac resin has the formula

wherein n is the average number of repeat units and n is less than 1.7.

4. The adhesive epoxy resin system of claim 1 wherein the hardener is a dicyandiamide.

5. The adhesive epoxy resin system of claim 1 wherein the epoxy novolac resin has a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445.

6. The adhesive epoxy resin system of claim 1 wherein the epoxy novolac resin has an average number of epoxide groups per molecule of more than 2 but less than 3.7.

7. The adhesive epoxy resin system of claim 1 wherein the epoxy novolac resin has a molecular weight of less than 750 g/mol.

Assignments (5)
CHANGE OF NAME Recorded Mar 30, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 055763/0358 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: LUTZ, ANDREAS; SCHNEIDER, DANIEL; HAAG, BENJAMIN ALEXANDER; MAEDER, IRENE; ASCHWANDEN, MARCEL
To: DOW EUROPE GMBH
Reel/Frame 055391/0183 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: DOW EUROPE GMBH
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 055391/0318 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 055400/0386 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
Reel/Frame 055427/0001 →
Continuity (2)
Provisional Application 62523853 · Jun 23, 2017
Related Publication 20210155835A1 · May 27, 2021