IP Library Assignment 055763/0358
Patent Assignment
Reel/Frame 055763/0358

Change of Name

Recorded: 2021-03-30 Pages: 7
Assignor
Assignee
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
974 CENTRE ROAD, BLDG 730, WILMINGTON, DELAWARE, 19805
Covered Property (1)
High Temperature Epoxy Adhesive Formulations
Application: 16/613,501 →
Publication: US 2021/0155835
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 24, 2021
From: LUTZ, ANDREAS; SCHNEIDER, DANIEL; HAAG, BENJAMIN ALEXANDER; MAEDER, IRENE
To: DOW EUROPE GMBH
Reel/Frame 055391/0183 →
Assignment of Assignor's Interest Feb 24, 2021
From: DOW EUROPE GMBH
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 055391/0318 →
Assignment of Assignor's Interest Feb 24, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 055400/0386 →
Assignment of Assignor's Interest Feb 24, 2021
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
Reel/Frame 055427/0001 →