IP Library › Assignment 055691/0350
Patent Assignment
Reel/Frame 055691/0350

Change of Name

Recorded: 2021-03-23 Pages: 2
Assignor
MICROSEMI SEMICONDUCTOR LIMITED
Executed: 2020-04-01
Assignee
MICROCHIP TECHNOLOGY CALDICOT LIMITED
CASTLEGATE BUSINESS PARK, UNIT 4, CALDICOT, NP26 5AD, UNITED KINGDOM
Covered Properties (3)
Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Creation
Application: 16/186,872 →
Publication: US 2020/0120797
Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Windows for Thermal Transport
Application: 16/569,252 →
Publication: US 2021/0035883
Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport
Application: 16/726,747 →
Publication: US 2021/0143080
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 12, 2018
From: SMITHELLS, JOHN ADAM TRACY DEMERCLEDEN
To: MICROSEMI SEMICONDUCTOR LIMITED
Reel/Frame 047475/0224 →
Assignment of Assignor's Interest Jul 5, 2019
From: BIDDLE, NINA
To: MICROSEMI SEMICONDUCTOR LIMITED
Reel/Frame 049676/0595 →
Assignment of Assignor's Interest Sep 12, 2019
From: SWIRE, PHILIP ANDREW; BIDDLE, NINA
To: MICROSEMI SEMICONDUCTOR LIMITED
Reel/Frame 050361/0818 →
Assignment of Assignor's Interest Dec 24, 2019
From: SWIRE, PHILIP ANDREW; BIDDLE, NINA
To: MICROSEMI SEMICONDUCTOR LIMITED
Reel/Frame 051363/0901 →