Patent Assignment
Reel/Frame 055801/0659
Assignment of Assignor's Interest
Recorded: 2021-04-01
Pages: 7
Assignors
LIU, YONG
Executed: 2018-09-24
LIN, YUSHENG
Executed: 2018-10-04
CHEN, HUIBIN
Executed: 2018-09-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Assembly Processes for Semiconductor Device Assemblies Including Spacer with Embedded Semiconductor Die
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 2, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 057054/0706 →
Release of Security Interest in Patents Recorded at Reel 057054, Frame 0706
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064083/0001 →