Assembly processes for semiconductor device assemblies including spacer with embedded semiconductor die

1. A method for producing a semiconductor device assembly, the method comprising:

defining a cavity in a conductive spacer;

electrically and thermally coupling a semiconductor die with the conductive spacer, such that the semiconductor die is at least partially embedded in the cavity, the semiconductor die having:

a first surface having active circuitry included therein;

a second surface opposite the first surface; and

a plurality of side surfaces each extending between the first surface of the semiconductor die and the second surface of the semiconductor die; and

electrically coupling a direct bonded metal (DBM) substrate with the first surface of the semiconductor die.

2. The method of claim 1 , wherein thermally and electrically coupling the semiconductor die with the conductive spacer includes thermally and electrically coupling the semiconductor die with the conductive spacer using an adhesive material disposed in the cavity.

3. The method of claim 2 , wherein the adhesive material includes at least one of a solder, a solder paste, a preform solder or a fluxless solder material disposed in the cavity.

4. The method of claim 1 , wherein:

the second surface of the semiconductor die is fully embedded in the cavity of the conductive spacer; and

the plurality of side surfaces of the semiconductor die are at least partially embedded in the cavity of the conductive spacer.

5. The method of claim 1 , further comprising injecting a low-modulus encapsulation material, such that the low-modulus encapsulation material is:

disposed between the conductive spacer and the DBM substrate; and

disposed between the first surface of the semiconductor die and the DBM substrate.

6. The method of claim 5 , wherein the low-modulus encapsulation material includes a silicone gel material.

7. The method of claim 5 , further comprising encapsulating the semiconductor die, the conductive spacer, the low-modulus encapsulation material and the DBM substrate in a molding compound, such that a surface of the DBM substrate is exposed through the molding compound.

8. The method of claim 1 , wherein the DBM substrate is a first DBM substrate and the cavity is disposed in a first surface of the conductive spacer, the method further comprising:

coupling a second DBM substrate with a second surface of the conductive spacer, the second surface of the conductive spacer being opposite the first surface of the conductive spacer.

9. The method of claim 1 , wherein:

the conductive spacer includes a copper spacer; and

defining the cavity includes mechanically stamping the cavity in a surface of the copper spacer.

10. The method of claim 1 , wherein the cavity is defined using at least one of a solder paste or a stamped solder preform.

11. The method of claim 1 , wherein:

the cavity is defined in a surface of the conductive spacer; and

the first surface of the semiconductor die is noncoplanar with the surface of the conductive spacer.

12. The method of claim 1 , wherein:

the cavity is defined in a surface of the conductive spacer; and

the first surface of the semiconductor die is coplanar with the surface of the conductive spacer.

13. A method for producing a semiconductor device assembly, the method comprising:

defining a cavity in a first surface of a conductive spacer;

electrically and thermally coupling a semiconductor die, such that the semiconductor die is at least partially embedded in the cavity;

electrically coupling a first direct bonded metal (DBM) substrate with a surface of the semiconductor die;

coupling a second DBM substrate with a second surface of the conductive spacer, the second surface of the conductive spacer being opposite the first surface of the conductive spacer;

injecting a low-modulus encapsulation material between the conductive spacer and the first DBM substrate, and between the surface of the semiconductor die and the first DBM substrate; and

encapsulating the semiconductor die, the conductive spacer, the low-modulus encapsulation material, the first DBM substrate, and the second DBM substrate in a molding compound.

14. The method of claim 13 , wherein defining the cavity in the first surface of the conductive spacer includes stamping the cavity in the first surface of the conductive spacer.

15. The method of claim 13 , wherein the low-modulus encapsulation material includes a silicone-based gel material.

16. The method of claim 13 , wherein thermally and electrically coupling the semiconductor die with the conductive spacer includes electrically coupling the semiconductor die with the conductive spacer using a fluxless solder material disposed in the cavity.

17. A method for producing a semiconductor device assembly, the method comprising:

defining a cavity in a first surface of a first conductive spacer;

electrically and thermally coupling a first semiconductor die with the first conductive spacer, the first semiconductor die being at least partially embedded in the cavity of the first conductive spacer;

defining a cavity in a first surface of a second conductive spacer;

electrically and thermally coupling a second semiconductor die with the second conductive spacer, the second semiconductor die being at least partially embedded in the cavity of the second conductive spacer;

electrically coupling a first direct bonded metal (DBM) substrate with:

a surface of the first semiconductor die; and

a surface of the second semiconductor die; and

electrically coupling a second DBM substrate with:

a second surface of the first conductive spacer, the second surface of the first conductive spacer being opposite the first surface of the first conductive spacer; and

a second surface of the second conductive spacer, the second surface of the second conductive spacer being opposite the first surface of the second conductive spacer.

18. The method of claim 17 , further comprising injecting a low-modulus encapsulation material, such that the low-modulus encapsulation material is:

disposed between the first conductive spacer and the first DBM substrate;

disposed between the surface of the first semiconductor die and the first DBM substrate;

disposed between the second conductive spacer and the first DBM substrate; and

disposed between the surface of the second semiconductor die and the first DBM substrate.

19. The method of claim 18 , further comprising encapsulating the first semiconductor die, the second semiconductor die, the first conductive spacer, the second conductive spacer, the low-modulus encapsulation material, the first DBM substrate, and the second DBM substrate in a molding compound,

a surface of the first DBM substrate being exposed through the molding compound, and

a surface of the second DBM substrate being exposed through the molding compound.

20. The method of claim 17 , wherein:

defining the cavity in the first surface of the first conductive spacer includes stamping the cavity in the first surface of the first conductive spacer; and

defining the cavity in the first surface of the second conductive spacer includes stamping the cavity in the first surface of the second conductive spacer.