Patent Assignment
Reel/Frame 055811/0453
Assignment of Assignor's Interest
Recorded: 2021-04-02
Pages: 4
Assignors
CHEAH, BOK ENG
Executed: 2019-07-11
KONG, JACKSON CHUNG PENG
Executed: 2019-07-12
FOO, LOKE YIP
Executed: 2019-07-09
LEE, WAI LING
Executed: 2019-07-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Power Delivery for Embedded Interconnect Bridge Devices and Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.