Patent Assignment
Reel/Frame 056123/0952
Assignment of Assignor's Interest
Recorded: 2021-05-04
Pages: 6
Assignors
SHARANGPANI, RAHUL
Executed: 2020-12-09
MAKALA, RAGHUVEER S
Executed: 2020-12-09
ZHOU, FEI
Executed: 2021-02-25
RAJASHEKHAR, ADARSH
Executed: 2020-12-09
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Semiconductor Structure Containing Multilayer Bonding Pads and Methods of Forming the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →