Patent Assignment
Reel/Frame 056411/0609
License
Recorded: 2021-06-02
Pages: 20
Assignee
HSEB DRESDEN GMBH
MANFRED-VON-ARDENNE-RING 4, DRESDEN, 01099, GERMANY
Covered Property
(1)
Method for Measuring Thickness Variations in a Layer of a Multilayer Semiconductor Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.