Patent Assignment
Reel/Frame 056502/0016
Assignment of Assignor's Interest
Recorded: 2021-06-10
Pages: 2
Assignor
TANAKA, KEIICHI
Executed: 2021-05-16
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Plasma Processing Device and Method for Processing Sample Using Same
Application:
16/495,369 →
Publication:
US 2021/0366791
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.