Change of Name

Recorded: 2021-08-09 Pages: 4

Assignor

Executed: 2020-02-14

Assignee

HITACHI HIGH-TECH CORPORATION

17-1, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Plasma Processing Device and Method for Processing Sample Using Same

Application: 16/495,369 →

Publication: US 2021/0366791

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.