IP Library › Assignment 056530/0991
Patent Assignment
Reel/Frame 056530/0991

Assignment of Assignor's Interest

Recorded: 2021-06-14 Pages: 5
Assignors
CHOI, CHANG HWAN
Executed: 2021-06-11
SONG, YUN HEUB
Executed: 2021-06-11
KU, BON CHEOL
Executed: 2021-06-11
Assignee
INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
17, HAENGDANG-DONG, SEONGDONG-GU, SEOUL, 133-070, KOREA, REPUBLIC OF
Covered Property (1)
Three-Dimensional Semiconductor Memory Device Including Ferroelectric Thin Film and Manufacturing Method of the Same
Application: 17/346,370 →
Publication: US 2022/0392918
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 7, 2023
From: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062608/0952 →