IP Library › Assignment 062608/0952
Patent Assignment
Reel/Frame 062608/0952

Assignment of Assignor's Interest

Recorded: 2023-02-07 Pages: 6
Assignor
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Properties (3)
Three-Dimensional Semiconductor Memory Device, Operating Method of the Same and Electronic System Including the Same
Application: 17/329,907 →
Publication: US 2021/0384221
Three-Dimensional Semiconductor Memory Device Including Ferroelectric Thin Film and Manufacturing Method of the Same
Application: 17/346,370 →
Publication: US 2022/0392918
Three-Dimensional Semiconductor Memory Device, Operating Method of the Same and Electronic System Including the Same
Application: 17/951,591 →
Publication: US 2023/0019540
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 25, 2021
From: SONG, YUN HEUB; CHOI, SUN JUN; CHOI, CHANG HWAN; JEONG, JAE KYEONG
To: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
Reel/Frame 056346/0345 →
Assignment of Assignor's Interest Jun 14, 2021
From: CHOI, CHANG HWAN; SONG, YUN HEUB; KU, BON CHEOL
To: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
Reel/Frame 056530/0991 →
Assignment of Assignor's Interest Feb 3, 2023
From: SONG, YUN HEUB; CHOI, SUN JUN; CHOI, CHANG HWAN; JEONG, JAE KYEONG
To: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
Reel/Frame 062578/0850 →