Patent Assignment
Reel/Frame 056689/0523
Assignment of Assignor's Interest
Recorded: 2021-06-28
Pages: 2
Assignor
SKC CO., LTD.
Executed: 2021-05-26
Assignee
SKC SOLMICS CO., LTD.
1043 GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad and Method for Preparing Semiconductor Device Using Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 16, 2021
From: SEO, JANGWON; JOENG, EUN SUN; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 055614/0201 →
Change of Name
Feb 13, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 062717/0084 →
Assignment of Assignor's Interest
Jun 2, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071277/0667 →