IP Library › Assignment 056713/0388
Patent Assignment
Reel/Frame 056713/0388

Assignment of Assignor's Interest

Recorded: 2021-06-30 Pages: 3
Assignor
CHANG, JEN-YUAN
Executed: 2021-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties (2)
Stacked Semiconductor Device Including a Cooling Structure
Application: 17/304,983 →
Publication: US 2022/0344233
Stacked Semiconductor Device Including a Heat Dissipation Structure
Application: 63/201,300 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 056713 Frame 0388. Assignor(S) Hereby Confirms the Assignment. May 5, 2022
From: CHANG, JEN-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 059856/0762 →