IP Library › Assignment 059856/0762
Patent Assignment
Reel/Frame 059856/0762

Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 056713 Frame 0388. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2022-05-05 Pages: 6
Assignor
CHANG, JEN-YUAN
Executed: 2021-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties (2)
Stacked Semiconductor Device Including a Cooling Structure
Application: 17/304,983 →
Publication: US 2022/0344233
Stacked Semiconductor Device Including a Heat Dissipation Structure
Application: 63/201,300 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2021
From: CHANG, JEN-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 056713/0388 →