Patent Assignment
Reel/Frame 056747/0221
Assignment of Assignor's Interest
Recorded: 2021-07-02
Pages: 2
Assignors
NAKAZAKI, SUSUMU
Executed: 2021-04-02
MIYAHARA, KUNIAKI
Executed: 2021-04-02
FUKUYO, TOMOYUKI
Executed: 2021-04-02
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Decomposing/Cleaning Composition, Method for Cleaning Adhesive Polymer, and Method for Producing Device Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.