Patent Assignment
Reel/Frame 056902/0804
Assignment of Assignor's Interest
Recorded: 2021-07-19
Pages: 4
Assignors
KITAMURA, HIROSHI
Executed: 2020-07-22
MASUDA, TSUYOSHI
Executed: 2020-09-04
MATSUMURA, YOSHIYUKI
Executed: 2020-09-04
NAMIKI, AKIHISA
Executed: 2020-09-04
SAITO, TAKESHI
Executed: 2020-09-07
Assignee
CABOT MICROELECTRONICS CORPORATION
870 N COMMONS DRIVE, AURORA, ILLINOIS, 60504
Covered Property
(1)
Silicon Wafer Polishing Composition and Method
Application:
17/379,279 →
Publication:
US 2022/0017781
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 19, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 056907/0536 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Change of Name
Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →