IP Library Assignment 056956/0537
Patent Assignment
Reel/Frame 056956/0537

Assignment of Assignor's Interest

Recorded: 2021-07-23 Pages: 6
Assignors
TOBA, MASAYA
Executed: 2021-06-17
KURAFUCHI, KAZUHIKO
Executed: 2021-06-17
MASUKO, TAKASHI
Executed: 2021-06-17
MITSUKURA, KAZUYUKI
Executed: 2021-06-17
ABE, SHINICHIRO
Executed: 2021-06-17
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Wiring Board and Method for Manufacturing the Same
Application: 17/415,030 →
Publication: US 2022/0071018
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →