IP Library Assignment 057204/0290
Patent Assignment
Reel/Frame 057204/0290

Assignment of Assignor's Interest

Recorded: 2021-08-17 Pages: 3
Assignors
FUJIMATSU, AI
Executed: 2021-07-29
IWANO, MAMIKO
Executed: 2021-07-28
YAMAMURA, NAO
Executed: 2021-07-29
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polishing Liquid and Polishing Method
Application: 17/431,635 →
Publication: US 2022/0112400
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →