IP Library › Assignment 057674/0110
Patent Assignment
Reel/Frame 057674/0110

Assignment of Assignor's Interest

Recorded: 2021-09-30 Pages: 5
Assignors
PARK, JONG HWI
Executed: 2021-09-14
KU, KAP-RYEOL
Executed: 2021-09-14
CHOI, JUNG WOO
Executed: 2021-09-14
JANG, BYUNG KYU
Executed: 2021-09-14
KYUN, MYUNG-OK
Executed: 2021-09-14
KIM, JUNG-GYU
Executed: 2021-09-14
SEO, JUNG DOO
Executed: 2021-09-14
Assignee
SKC CO., LTD.
84, JANGAN-RO 309BEON-GIL, JANGAN-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property (1)
Silicon Carbide Wafer and Method of Preparing the Same
Application: 17/477,856 →
Publication: US 2022/0090295
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 18, 2021
From: PARK, JONG HWI; KU, KAP-RYEOL; CHOI, JUNG WOO; JANG, BYUNG KYU
To: SKC CO., LTD.
Reel/Frame 057840/0977 →
Assignment of Assignor's Interest Jan 5, 2022
From: SKC CO., LTD.
To: SENIC INC.
Reel/Frame 058555/0113 →
Assignment of Assignor's Interest Nov 20, 2025
From: SENIC INC.
To: EIN CRYSTAL CO., LTD.
Reel/Frame 072990/0001 →