IP Library › Assignment 058555/0113
Patent Assignment
Reel/Frame 058555/0113

Assignment of Assignor's Interest

Recorded: 2022-01-05 Pages: 3
Assignor
SKC CO., LTD.
Executed: 2021-12-13
Assignee
SENIC INC.
17-15, 4SANDAN 7-RO, JIKSAN-EUP, SEOBUK-GU, CHUNGCHEONGNAM-DO, CHEONAN-SI, 31040, KOREA, REPUBLIC OF
Covered Properties (2)
Silicon Carbide Wafer and Method of Preparing the Same
Application: 17/477,856 →
Publication: US 2022/0090295
Method of Cleaning Wafer and Wafer with Reduced Impurities
Application: 17/477,866 →
Publication: US 2022/0093419
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 30, 2021
From: PARK, JONG HWI; KU, KAP-RYEOL; CHOI, JUNG WOO; JANG, BYUNG KYU
To: SKC CO., LTD.
Reel/Frame 057674/0110 →
Assignment of Assignor's Interest Sep 30, 2021
From: PARK, JONG HWI; YOO, IL HWAN; KU, KAP-RYEOL; KIM, JUNG-GYU
To: SKC CO., LTD.
Reel/Frame 057674/0115 →
Assignment of Assignor's Interest Oct 18, 2021
From: PARK, JONG HWI; KU, KAP-RYEOL; CHOI, JUNG WOO; JANG, BYUNG KYU
To: SKC CO., LTD.
Reel/Frame 057840/0977 →
Assignment of Assignor's Interest Nov 20, 2025
From: SENIC INC.
To: EIN CRYSTAL CO., LTD.
Reel/Frame 072990/0001 →