Patent Assignment
Reel/Frame 057759/0974
Assignment of Assignor's Interest
Recorded: 2021-10-12
Pages: 7
Assignors
ONG, YEE LUN
Executed: 2021-10-01
YEW, TEONG GUAN
Executed: 2021-10-02
CHEAH, BOK ENG
Executed: 2021-10-01
KONG, JACKSON CHUNG PENG
Executed: 2021-10-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Recessed Vertical Interconnects for Device Miniaturization
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.