Patent Assignment
Reel/Frame 057783/0550
Assignment of Assignor's Interest
Recorded: 2021-10-13
Pages: 8
Assignors
BAUER, RICK
Executed: 2021-08-04
MARTINSON, JERRAD
Executed: 2021-08-04
HOFFSTATTER, SHANE
Executed: 2021-08-04
LAUDAL, DOYLE
Executed: 2021-08-04
LUGERT, MIKE
Executed: 2021-10-06
LEN, MIKE
Executed: 2021-02-12
Assignee
ANAREN, INC.
6635 KIRKVILLE ROAD, EAST SYRACUSE, NEW YORK, 13057
Covered Properties
(2)
Printed Circuit Board Assemblies with Engineered Thermal Paths and Methods of Manufacturing
PCT:
PCT/US2021/015810 ↗
Method of Manufacturing Printed Circuit Board Assemblies with Engineered Thermal Paths
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 23, 2021
From: ANAREN, INC.
To: TTM TECHNOLOGIES INC.
Reel/Frame 056635/0640 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →