IP Library › Assignment 057870/0861
Patent Assignment
Reel/Frame 057870/0861

Assignment of Assignor's Interest

Recorded: 2021-10-21 Pages: 4
Assignor
HAYASHI, NAOKI
Executed: 2016-09-27
Assignee
J-DEVICES CORPORATION
1913-2, TAKEGASHITA FUKURA, USUKI-SHI, OITA, 875-0053, JAPAN
Covered Property (1)
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Application: 17/507,653 →
Publication: US 2022/0044991
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 21, 2021
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 057870/0900 →
Change of Name Oct 21, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 057889/0074 →