IP Library › Assignment 057889/0074
Patent Assignment
Reel/Frame 057889/0074

Change of Name

Recorded: 2021-10-21 Pages: 16
Assignor
J-DEVICES CORPORATION
Executed: 2020-01-01
Assignee
AMKOR TECHNOLOGY JAPAN, INC.
1913-2, TAKEGASHITA FUKURA, USUKI-SHI, OITA, 875-0053, JAPAN
Covered Property (1)
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Application: 17/507,653 →
Publication: US 2022/0044991
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 21, 2021
From: HAYASHI, NAOKI
To: J-DEVICES CORPORATION
Reel/Frame 057870/0861 →
Assignment of Assignor's Interest Oct 21, 2021
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 057870/0900 →