Patent Assignment
Reel/Frame 057870/0900
Assignment of Assignor's Interest
Recorded: 2021-10-21
Pages: 5
Assignor
AMKOR TECHNOLOGY JAPAN, INC.
Executed: 2020-01-01
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12-03, 248373, SINGAPORE
Covered Property
(1)
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.