Patent Assignment
Reel/Frame 057957/0826
Assignment of Assignor's Interest
Recorded: 2021-10-29
Pages: 4
Assignors
HANANO, MASAYUKI
Executed: 2021-09-23
TAKAHASHI, HISATO
Executed: 2021-09-15
TAKIZAWA, TOSHIO
Executed: 2021-09-13
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME,, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Polishing Solution, Polishing Solution Set, Polishing Method, and Defect Suppressing Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.