Patent Assignment
Reel/Frame 058175/0895
Assignment of Assignor's Interest
Recorded: 2021-11-22
Pages: 4
Assignors
ZINKEVICH, MATSVEI
Executed: 2021-11-19
ASMUS, TIM
Executed: 2021-11-19
DIETMANN, STEFAN
Executed: 2021-11-19
Assignee
HERAEUS NEXENSOS GMBH
REINHARD-HERAEUS-RING 23, KLEINOSTHEIM, 63801, GERMANY
Covered Property
(1)
Improved High-Temperature Chip
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.