IP Library › Assignment 069310/0820
Patent Assignment
Reel/Frame 069310/0820

Change of Name

Recorded: 2024-11-05 Pages: 10
Assignor
HERAEUS NEXENSOS GMBH
Executed: 2023-04-05
Assignee
YAGEO NEXENSOS GMBH
REINHARD-HERAEUS-RING 23, KLEINOSTHEIM, 63801, GERMANY
Covered Property (1)
Improved High-Temperature Chip
Application: 17/611,995 →
Publication: US 2022/0196486
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 22, 2021
From: ZINKEVICH, MATSVEI; ASMUS, TIM; DIETMANN, STEFAN
To: HERAEUS NEXENSOS GMBH
Reel/Frame 058175/0895 →