Patent Assignment
Reel/Frame 058201/0311
Assignment of Assignor's Interest
Recorded: 2021-11-23
Pages: 2
Assignor
NAGOYA, TOMOHIRO
Executed: 2021-11-22
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame with Temporary Protective Film, Encapsulation Molded Body with Temporary Protective Film, and Method for Manufacturing Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.