Patent Assignment
Reel/Frame 058308/0152
Assignment of Assignor's Interest
Recorded: 2021-12-06
Pages: 8
Assignors
HOU, LIN
Executed: 2021-12-04
RABKIN, PETER
Executed: 2021-12-03
CHEN, YANGYIN
Executed: 2021-12-06
HIGASHITANI, MASAAKI
Executed: 2021-12-03
SHARANGPANI, RAHUL
Executed: 2021-12-03
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Bonded Assembly Including Interconnect-Level Bonding Pads and Methods of Forming the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →