IP Library Assignment 058347/0973
Patent Assignment
Reel/Frame 058347/0973

Assignment of Assignor's Interest

Recorded: 2021-12-09 Pages: 4
Assignors
EDELSTEIN, DANIEL C.
Executed: 2015-11-16
YANG, CHIH-CHAO
Executed: 2015-11-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Advanced Copper Interconnects with Hybrid Microstructure
Application: 17/546,511 →
Publication: US 2022/0165620
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 058348/0028 →
Change of Name Aug 3, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061067/0709 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →