Assignment of Assignor's Interest

Recorded: 2021-12-18 Pages: 7

Assignors

HAN, JUNG KYU

Executed: 2021-09-21

SUN, JIWEI

Executed: 2021-09-23

QIAN, ZHIGUO

Executed: 2021-09-24

PIETAMBARAM, SRINIVAS

Executed: 2021-09-22

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Embedded Glass Cores in Package Substrates and Related Methods

Application: 17/483,444 →

Publication: US 2023/0088928

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.