Embedded glass cores in package substrates and related methods
Embedded glass cores in package substrates and related methods are disclosed herein including an integrated circuit including a substrate having a first side and a second side opposite the first side, a plurality of vias disposed within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate, a glass core surrounding a first via of the plurality of vias, and an organic core surrounding a second via of the plurality of vias, the second via different than the first via.
1 . An integrated circuit package comprising:
a substrate having a first side and a second side opposite the first side;
a plurality of vias within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate;
a glass core surrounding a first via of the plurality of vias, the glass core defining an exterior wall of the first via; and
an organic core surrounding a second via of the plurality of vias, the second via different than the first via, the organic core and the glass core in a same plane, the plane substantially parallel to and between the first and second sides of the substrate.
2 . The integrated circuit package of claim 1 , wherein the glass core has a first surface and a second surface opposite the first surface, and the organic core has a first surface and a second surface opposite the first surface, the first via extending through the glass core between the first surface of the glass core and the second surface of the glass core, the second via extending through the organic core between the first surface of the organic core and the second surface of the organic core, the first surface of the glass core substantially flush with the first surface of the organic core, the second surface of the glass core substantially flush with the second surface of the organic core.
3 . The integrated circuit package of claim 1 , wherein the organic core is adjacent to the glass core in the plane.
4 . The integrated circuit package of claim 1 , wherein the glass core is a first glass core region within the organic core, the integrated circuit package including a second glass core region within the organic core, the first glass core region distinct and spaced apart from the second glass core region, the second glass core region surrounding a third via of the plurality of vias.
5 . The integrated circuit package of claim 1 , wherein the organic core completely surrounds the glass core in the plane.
6 . The integrated circuit package of claim 1 , wherein the glass core completely surrounds the organic core in the plane.
7 . The integrated circuit package of claim 1 , wherein the first via has a first diameter and the second via has a second diameter, the first diameter smaller than the second diameter.
8 . The integrated circuit package of claim 1 , wherein a first subset of vias extend through the glass core and a second subset of vias extend through the organic core, the first subset of vias including the first via, the second subset of vias including the second via, the first subset of vias spaced apart by a first pitch, the second subset of vias spaced apart by a second pitch, the first pitch smaller than the second pitch.
9 . The integrated circuit package of claim 1 , wherein the second via is a magnetic core inductor.
10 . The integrated circuit package of claim 1 , wherein the glass core includes a plurality-stack of layers of glass.
11 . The integrated circuit package of claim 10 , wherein a combined thickness of the stacked layers of glass corresponds to a thickness of the organic core.
12 . An apparatus comprising:
a substrate having a first side and a second side opposite the first side;
a plurality of vias within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate;
a glass core surrounding a first via of the plurality of vias, the glass core defining an exterior wall of the first via; and
an organic core surrounding a second via of the plurality of vias, the second via different than the first via, a first end of the first via closer to the first side of the substrate than a second end of the first via is to the first side of the substrate, a first end of the second via closer to the first side of the substrate than a second end of the second via is to the first side of the substrate, the first end of the first via closer to the first end of the second via than the second end of the first via is to the first end of the second via.
13 . The apparatus of claim 12 , wherein the first via is substantially parallel to the second via.
14 . The apparatus of claim 12 , wherein the organic core surrounds the glass core.
15 . The apparatus of claim 12 , wherein the glass core surrounds the organic core.
16 . The apparatus of claim 12 , wherein the glass core corresponds to a first solid piece of glass, the apparatus including a third via extending through a second solid piece of glass, the first piece of glass separated from the second piece of glass by a portion of the organic core.
17 . The apparatus of claim 12 , wherein the glass core includes a first block of glass and a second block of glass, the first block of glass stacked on the second block of glass.
18 . The apparatus of claim 12 , wherein the second via corresponds to a magnetic core inductor.
19 . An integrated circuit package comprising:
a substrate having a first side and a second side opposite the first side;
a plurality of vias within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate;
a glass core surrounding a first via of the plurality of vias, the glass core defining an exterior wall of the first via; and
an organic core surrounding a second via of the plurality of vias, the second via different than the first via, the organic core surrounding the glass core along a plane transverse to and passing through a longitudinal length of the first via.
20 . The integrated circuit package of claim 19 , wherein the glass core is a first region of glass, the integrated circuit package including a second region of glass surrounding a third via of the plurality of vias, the second region of glass separated from the first region of glass by a portion of the organic core.
21 . The integrated circuit package of claim 20 , wherein the organic core surrounds the second region of glass along the plane transverse to and passing through the longitudinal length of the first via.
22 . The integrated circuit package of claim 19 , wherein the first via has a first diameter and the second via has a second diameter larger than the first diameter.
23 . The integrated circuit package of claim 19 , wherein the first via is one of a first subset of vias in the glass core, and the second via is one of a second subset of vias in the organic core, different ones of the first subset of vias spaced apart by a first pitch, different ones of the second subset of vias spaced apart by a second pitch greater than the first pitch.