IP Library Assignment 058429/0400
Patent Assignment
Reel/Frame 058429/0400

Assignment of Assignor's Interest

Recorded: 2021-12-20 Pages: 3
Assignors
HOEGLAUER, JOSEF
Executed: 2021-12-14
POLSTER, TOBIAS
Executed: 2021-12-14
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Method of Processing a Semiconductor Wafer, Semiconductor Die, and Method of Producing a Semiconductor Module
Application: 17/555,709 →
Publication: US 2023/0197663
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 20, 2021
From: CHEAH, CHUAN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 058429/0457 →
Assignment of Assignor's Interest Mar 20, 2023
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 063028/0593 →