Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module
A method of processing a semiconductor wafer includes: forming an electronic device at each die location of the semiconductor wafer; partially forming a frontside metallization over a frontside of the semiconductor wafer at each die location; partially forming a backside metallization over a backside of the semiconductor wafer at each die location; and after partially forming both the frontside metallization and the backside metallization but without completing either the frontside metallization or the backside metallization, singulating the semiconductor wafer between the die locations to form a plurality of individual semiconductor dies, wherein the partially formed frontside metallization and the partially formed backside metallization have a same composition. Semiconductor dies and methods of producing semiconductor modules are also described.
1. A method of processing a semiconductor wafer, the method comprising:
forming an electronic device at each die location of the semiconductor wafer;
partially forming a frontside metallization over a frontside of the semiconductor wafer at each die location;
partially forming a backside metallization over a backside of the semiconductor wafer at each die location; and
after partially forming both the frontside metallization and the backside metallization but without completing either the frontside metallization or the backside metallization, singulating the semiconductor wafer between the die locations to form a plurality of individual semiconductor dies,
wherein the partially formed frontside metallization and the partially formed backside metallization have a same composition.
2. The method of claim 1 , wherein the partially formed frontside metallization and the partially formed backside metallization both comprise Al (aluminum).
3. The method of claim 1 , wherein the partially formed frontside metallization and the partially formed backside metallization both comprise AlCu (aluminum copper).
4. The method of claim 1 , wherein the partially formed frontside metallization is a multi-layer stack of different metals and/or metal alloys, and wherein the partially formed backside metallization comprises the same multi-layer stack of different metals and/or metal alloys as the partially formed frontside metallization.
5. The method of claim 1 , wherein the electronic device included in each individual semiconductor die is a vertical power transistor, wherein a gate electrode and a source electrode of the vertical power transistor is disposed at a first side of each individual semiconductor die, wherein a drain electrode of the vertical power transistor die is disposed at a second side of each individual semiconductor die opposite the first side, wherein the partially formed frontside metallization of each individual semiconductor die is patterned and forms the gate electrode and the source electrode of the vertical power transistor, and wherein the partially formed backside metallization of each individual semiconductor die forms the drain electrode of the vertical power transistor.
6. The method of claim 1 , wherein the electronic device included in each individual semiconductor die is a driver or controller for a power transistor, wherein each electrode of the driver or controller is disposed at a first side of each individual semiconductor die, wherein the partially formed frontside metallization of each individual semiconductor die is patterned and forms each electrode of the driver or controller, and wherein the partially formed backside metallization of each individual semiconductor die forms a heat dissipation structure at a second side opposite the first side.