Patent Assignment
Reel/Frame 063028/0593
Assignment of Assignor's Interest
Recorded: 2023-03-20
Pages: 4
Assignor
INFINEON TECHNOLOGIES AMERICAS CORP.
Executed: 2023-03-10
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Properties
(3)
Method of Processing a Semiconductor Wafer, Semiconductor Die, and Method of Producing a Semiconductor Module
Radar-Based Target Tracker
Modular Power Device Package Embedded in Circuit Carrier
Application:
17/870,405 →
Publication:
US 2024/0030820
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2021
From: HOEGLAUER, JOSEF; POLSTER, TOBIAS
To: INFINEON TECHNOLOGIES AG
Reel/Frame 058429/0400 →
Assignment of Assignor's Interest
Dec 20, 2021
From: CHEAH, CHUAN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 058429/0457 →
Assignment of Assignor's Interest
Jul 26, 2022
From: KESARAJU, SAIVEENA; BAL, JAGJIT SINGH; SUN, YUE
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 060624/0168 →
Assignment of Assignor's Interest
Aug 3, 2022
From: KESSLER, ANGELA
To: INFINEON TECHNOLOGIES AG
Reel/Frame 060707/0227 →
Assignment of Assignor's Interest
Aug 3, 2022
From: CHO, EUNG SAN; CLAVETTE, DANNY
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 060707/0405 →