IP Library › Assignment 058429/0457
Patent Assignment
Reel/Frame 058429/0457

Assignment of Assignor's Interest

Recorded: 2021-12-20 Pages: 3
Assignor
CHEAH, CHUAN
Executed: 2021-12-15
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Method of Processing a Semiconductor Wafer, Semiconductor Die, and Method of Producing a Semiconductor Module
Application: 17/555,709 →
Publication: US 2023/0197663
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 20, 2021
From: HOEGLAUER, JOSEF; POLSTER, TOBIAS
To: INFINEON TECHNOLOGIES AG
Reel/Frame 058429/0400 →
Assignment of Assignor's Interest Mar 20, 2023
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 063028/0593 →