IP Library › Assignment 058847/0851
Patent Assignment
Reel/Frame 058847/0851

Assignment of Assignor's Interest

Recorded: 2022-02-01 Pages: 4
Assignors
ALBERT, SVEN
Executed: 2019-11-04
BOETTCHER, RENÉ
Executed: 2019-11-04
BÕHM, ALEXANDER
Executed: 2019-11-04
LINDNER, MIKE
Executed: 2019-11-04
SCHMIDT, THOMAS
Executed: 2019-09-27
Assignee
3D-MICROMAC AG
TECHNOLOGIE-CAMPUS 8, CHEMNITZ, 09126, GERMANY
Covered Property (1)
Method and Manufacturing System of Producing Microelectronic Components with a Layer Structure
Application: 17/590,313 →
Publication: US 2022/0216364
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Third Inventors Name Previously Recorded at Reel: 058847 Frame: 0851. Assignor(S) Hereby Confirms the Assignment. Feb 15, 2022
From: ALBERT, SVEN; BOETTCHER, RENÉ; BÖHM, ALEXANDER; LINDNER, MIKE
To: 3D-MICROMAC AG
Reel/Frame 059110/0807 →